Li Hailong

Research direction

Electronics Packaging Technology

Education

2005.09~2009.07, Bachelor's Degree, Welding Science and Engineering, Harbin Institute of Technology< br>2009.09~2011.07, Master's Degree, Materials Processing Engineering, Harbin Institute of Technology< br>2011.09~2015.10, Ph. D., Materials Processing Engineering, Harbin Institute of Technology

Employment history

2015.12~present, Lecturer, School of Materials Science and Engineering, Tianjin University

Areas of research interest

1. Electronics Packaging Technology< br>2. Micro-/Nano-Joining Technology< br>3. Reliability Testing and Analysis< br>4. Numerical Simulation

Selected publications (Journal articles, patents and books)

[1]Hailong Li, Rong An, Chunqing Wang, et al. Suppression of void nucleation in Sn3.0Ag0.5Cu/Cu solder joint by rapid thermal processing [J]. Mater Lett, 2015, 158(0): 252-4.< br>[2]Hailong Li, Rong An, Chunqing Wang, et al. In situ quantitative study of microstructural evolution at the interface of Sn3.0Ag0.5Cu/Cu solder joint during solid state aging [J]. J Alloy Compd, 2015, 634(0): 94-8.< br>[3]Hailong Li, Rong An, Chunqing Wang, et al. Effect of Cu grain size on the voiding propensity at the interface of SnAgCu/Cu solder joints [J]. Mater Lett, 2015, 144(0): 97-9.